Method of Forming Trenches

ABSTRACT

A method of forming a semiconductor device includes forming a material layer over a substrate and forming a first trench in the material layer, forming a conformal capping layer along sidewalls of the first trench, forming a second trench in the material layer while the capping layer is disposed along sidewalls of the first trench and forming a conductive feature within the first trench and the second trench.

PRIORITY DATA

The present application is a continuation application of U.S. patentapplication Ser. No. 16/101,778, filed Aug. 13, 2018, which is acontinuation application of U.S. patent application Ser. No. 15/670,000,filed Aug. 7, 2017, which is a continuation application of U.S. patentapplication Ser. No. 14/976,751, filed Dec. 21, 2015, each of which ishereby incorporated by reference in its entirety.

BACKGROUND

The semiconductor integrated circuit (IC) industry has experienced rapidgrowth. Technological advances in IC design and material have producedgenerations of ICs where each generation has smaller and more complexcircuits than the previous generation. In the course of IC evolution,functional density (i.e., the number of interconnected devices per chiparea) has generally increased while geometry size (i.e., the smallestcomponent (or line) that can be created using a fabrication process) hasdecreased.

This scaling down process generally provides benefits by increasingproduction efficiency and lowering associated costs. Such scaling downhas also increased the complexity of IC processing and manufacturing.For these advances to be realized, similar developments in IC processingand manufacturing are needed. When a semiconductor device such as ametal-oxide-semiconductor field-effect transistor (MOSFET) is scaleddown through various technology nodes, interconnects of conductive linesand associated dielectric materials that facilitate wiring between thetransistors and other devices play a more important role in ICperformance improvement. Although existing methods of fabricating ICdevices have been generally adequate for their intended purposes, theyhave not been entirely satisfactory in all respects. For example, it isdesired to have improvements in the formation of trenches ininterconnection structures.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It isnoted that, in accordance with the standard practice in the industry,various features are not drawn to scale. In fact, the dimensions of thevarious features may be arbitrarily increased or reduced for clarity ofdiscussion.

FIG. 1 is a flow chart of a method of fabricating a device or portionprovided according to one or more aspects of the present disclosure.

FIGS. 2, 3, 4, 5A, 5B, 6, 7A, 7B and 7C are cross-section views of anembodiment of a device 200 according to aspects of the method of FIG. 1.

DETAILED DESCRIPTION

The following disclosure provides many different embodiments, orexamples, for implementing different features of the provided subjectmatter. Specific examples of components and arrangements are describedbelow to simplify the present disclosure. These are, of course, merelyexamples and are not intended to be limiting. For example, the formationof a first feature over or on a second feature in the description thatfollows may include embodiments in which the first and second featuresare formed in direct contact, and may also include embodiments in whichadditional features may be formed between the first and second features,such that the first and second features may not be in direct contact. Inaddition, the present disclosure may repeat reference numerals and/orletters in the various examples. This repetition is for the purpose ofsimplicity and clarity and does not in itself dictate a relationshipbetween the various embodiments and/or configurations discussed.

Further, spatially relative terms, such as “beneath,” “below,” “lower,”“above,” “upper” and the like, may be used herein for ease ofdescription to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the figures. The spatiallyrelative terms are intended to encompass different orientations of thedevice in use or operation in addition to the orientation depicted inthe figures. The apparatus may be otherwise oriented (rotated 90 degreesor at other orientations) and the spatially relative descriptors usedherein may likewise be interpreted accordingly.

FIG. 1 is a flowchart of one embodiment of a method 100 of fabricatingone or more semiconductor devices according to aspects of the presentdisclosure. The method 100 is discussed in detail below, with referenceto a semiconductor device precursor 200 shown in FIGS. 2, 3, 4, 5A, 5B,6, 7A, 7B and 7C for the sake of example. It is understood thatadditional steps can be provided before, during, and/or after themethod, and some of the steps described can be replaced or eliminatedfor other embodiments of the method.

Referring to FIGS. 1 and 2, the method 100 begins at step 102 by forminga material layer 310 over a substrate 210. The substrate 210 may includesilicon. Alternatively or additionally, the substrate 210 may includeother elementary semiconductor such as germanium. The substrate 210 mayalso include a compound semiconductor such as silicon carbide, galliumarsenic, indium arsenide, and indium phosphide. The substrate 210 mayinclude an alloy semiconductor such as silicon germanium, silicongermanium carbide, gallium arsenic phosphide, and gallium indiumphosphide. In one embodiment, the substrate 210 includes an epitaxiallayer. For example, the substrate 210 may have an epitaxial layeroverlying a bulk semiconductor. Furthermore, the substrate 210 mayinclude a semiconductor-on-insulator (SOI) structure. For example, thesubstrate 210 may include a buried oxide (BOX) layer formed by a processsuch as separation by implanted oxygen (SIMOX) or other suitabletechnique, such as wafer bonding and grinding.

The substrate 210 may also include various p-type doped regions and/orn-type doped regions, implemented by a process such as ion implantationand/or diffusion. Those doped regions include n-well, p-well, lightdoped region (LDD), heavily doped source and drain (S/D), and variouschannel doping profiles configured to form various IC devices, such as acomplimentary metal-oxide-semiconductor field-effect transistor(CMOSFET), imaging sensor, and/or light emitting diode (LED).

The substrate 210 may also include various isolation features. Theisolation features separate various device regions in the substrate 210.The isolation features include different structures formed by usingdifferent processing technologies. For example, the isolation featuresmay include shallow trench isolation (STI) features. The formation of aSTI may include etching a trench in the substrate 210 and filling in thetrench with insulator materials such as silicon oxide, silicon nitride,or silicon oxynitride. The filled trench may have a multi-layerstructure such as a thermal oxide liner layer with silicon nitridefilling the trench. A chemical mechanical polishing (CMP) may beperformed to polish back excessive insulator materials and planarize thetop surface of the isolation features.

The substrate 210 may also include one more conductive features (e.g.,lines or vias) formed thereon. The conductive features may form aportion of an interconnect structure referred to as a multi-layerinterconnect (MLI) typically including a plurality of conductive layers(referred to as metal layers), contacts, and/or vias providing aninterconnection of the conductive layers and/or other conductivefeatures. As used herein the term “via” may include a contact feature.Depending on the layer level, the vias may provide connection to theconductive lines (wiring), connection between conductive lines (metalwiring), connection to doped regions, connection to a gate oftransistor, connection to a plate of capacitor, and/or connection toother features of a semiconductor device or integrated circuit. Theconductive features of the MLI may include barrier or liner layers. Inan embodiment, the conductive features include aluminum (Al), copper(Cu), tungsten (W), respective alloys, combinations thereof, and/orother suitable conductive material. The conductive features may alsoinclude silicide features, for example, disposed on source, drain, orgate structures of a semiconductor device.

The substrate 210 may also include a plurality of inter-level dielectric(ILD) layers and conductive features integrated to form an interconnectstructure and result a functional integrated circuit. In one example,the substrate 210 may include a portion of the interconnect structureand the interconnect structure includes a MLI structure and an ILD layerintegrated with a MLI structure, providing an electrical routing tocouple various devices in the substrate 210 to the input/output powerand signals. The interconnect structure includes various metal lines,contacts and via features (or via plugs). The metal lines providehorizontal electrical routing. The contacts provide vertical connectionbetween silicon substrate and metal lines while via features providevertical connection between metal lines in different metal layers.

The method 100 may be used to form a portion of the MLI structurediscussed above. In other words, the conductive lines and vias (whichinclude contacts) of an MLI may be formed using one or more of the stepsof the method 100.

The material layer 310 may include silicon oxide, undoped or dopedsilicate glasses, such as boron phosphate silicate glass (BPSG),phosphate silicate glass (PSG), undoped or doped thermally grown siliconoxide, undoped or doped TEOS deposited silicon oxide, organo-silicateglass, porous low-k materials, and/or other suitable dielectricmaterials. In some embodiments, the material layer 310 includesextra-low k (ELK) dielectric. Suitable extra-low k material may includefluorinated silica glass (FSG), carbon doped silicon oxide, BlackDiamond® (Applied Materials of Santa Clara, Calif.), Xerogel, Aerogel,amorphous fluorinated carbon, Parylene, bis-benzocyclobutenes (BCB),SILK (Dow Chemical, Midland, Mich.), polyimide, porous polymer and/orother suitable materials as examples.

In some embodiments, prior to forming the material layer 310, an etchstop layer (ESL) 305 is formed over the substrate 210 and the materiallayer 310 is then formed over the ESL 305. The ESL 305 has an etchselectivity to the material layer 310 and functions to stop etch duringsubsequent operation to pattern the material layer 310. The ESL 305 mayinclude silicon nitride, silicon oxynitride, silicon carbide, titaniumoxide, titanium nitride, tantalum oxide, tantalum nitride, combinationsthereof, and/or other suitable materials. In various examples, the ESL305 and the material layer 310 may be deposited by chemical vapordeposition (CVD), physical vapor deposition (PVD), atomic layerdeposition (ALD), thermal oxidation, spin-on coating, combinationsthereof, or other suitable techniques.

Referring again to FIGS. 1 and 2, method 100 proceeds to step 104 byforming a first patterned hard mask (HM) 410 over the material layer 310and a second patterned HM 420 over the first patterned HM 410. The firstpatterned HM 410 has a first opening 415 with a first width w₁ and thesecond HM 420 has a second opening 515 with a second width w₂. In thepresent embodiment, the second width w₂ is greater than the first widthw₁. In an embodiment, the second width w₂ is greater than two times thewidth of first width w₁. In some embodiments, the first opening 415defines a via feature and the second opening 425 defines a metal lineconnecting with the via feature. The second opening 425 connects andaligns to the first opening 415.

The first and second patterned HMs, 410 and 420, may include siliconoxide, silicon nitride, silicon oxynitride, silicon carbide, titaniumoxide, titanium nitride, tantalum oxide, tantalum nitride, combinationsthereof, and/or other suitable materials. In the present embodiment, thefirst patterned HM 410 may include a material which is different fromthe material layer 310 to achieve etching selectivity during subsequentetch processes. The second patterned HM 420 may include a material whichis different from the material layer 310 and the first patterned HM 410to achieve etching selectivity during subsequent etch processes. In anembodiment, the material layer 310 includes extra-low k dielectric, thefirst patterned HM 410 includes silicon nitride and the second patternedHM 420 includes titanium nitride.

The first and second patterned HMs, 410 and 420, may be formed byprocesses of deposition, lithography and etch. The deposition processmay include CVD, ALD, PVD, thermal oxidation, spin-on coatingcombinations thereof, and/or other suitable techniques. An exemplarylithography process may include forming a photoresist layer, exposingthe photoresist layer by a lithography exposure process, performing apost-exposure bake process, and developing the photoresist layer to formthe patterned resist layer. The etching process may include a wet etch,a dry etch, and/or a combination thereof.

Referring to FIGS. 1 and 3, method 100 proceeds to step 106 by etchingthe material layer 310 through the first opening 415 to form a viatrench 510. In some embodiments, the via trench 510 extends through thematerial layer 310 down to the ESL 305. The etch process may include awet etch, a dry etch, and/or a combination thereof. For example, a dryetching process may use chlorine-containing gases, fluorine-containinggases, other etching gases, and/or a combination thereof. The wetetching solutions may include NH₄OH (ammonium hydroxide), HF(hydrofluoric acid) or diluted HF, deionized water, TMAH(tetramethylammonium hydroxide), other suitable wet etching solutions,or combinations thereof. The via etch process may be tuned with variousetching parameters, such as etchant used, etching temperature, etchingsolution concentration, etching pressure, etchant flow rate, and/orother suitable parameters. In some embodiments, the etch process ischosen to selectively etch the material layer 310 without substantiallyetching the first and second patterned HMs, 410 and 420. As has beenmentioned previously, the ESL 305 serves as an etch stop layer, whichimproves etch process window and profile control. In some embodiments,the etch process includes an anisotropic dry etch and thus the viatrench 510 is formed with a vertical profile and has a same width as thefirst opening 415, namely the first width w₁. As an example, via etchprocess may include a plasma dry etching process using a fluorine-basedchemistry, such as CF₄, SF₆, CH₂F₂, CHF₃, and/or C₂F₆.

Referring to FIGS. 1 and 4, method 100 proceeds to step 108 by forming aconformal dielectric capping layer 610 along sidewalls of the via trench510. Typically, after forming a trench (e.g. via trench 510) through anextra-low k dielectric material (e.g. material layer 310) additionallyetching processes are performed on the extra-low k dielectric materialwhich degrades/changes the trench profile. This changing trench profileleads to adverse impacts on device performance, such as increasing pitchsize design rule, increasing lithography overlay constrains, increasingetching process variation, poor metal gap filling widow and high viaresistance.

To prevent at least a portion of the profile of via trench 510 fromchanging during subsequent processing, the present disclosure forms aprotection layer (or capping layer) along the sidewalls and bottom ofthe via trench 510. Specifically, as shown in FIG. 4, dielectric cappinglayer 610 is formed along sidewalls and the base of the via trench 510to assist in protecting/maintaining at least a portion of the profile ofvia trench 510 (e.g. width w₃) during subsequent etch processes. Thedielectric capping layer 610 includes a material that it is differentfrom the material layer 310 to achieve etching selectivity duringsubsequent etch processes and has lower polymer formation tendency thanthe material layer 310 during subsequent etch processes. In someembodiments, the dielectric capping layer 610 may includenon-carbon-containing materials for polymer buildup reduction. In anembodiment, a silicon nitride capping layer 610 is formed alongsidewalls of the via trench 510 in the extra-low k dielectric layer 310.Alternatively, a silicon oxynitride capping layer 610 is formed alongsidewalls and bottom of the via trench 510 formed in the ELK layer 310.The dielectric capping layer 610 may be formed by CVD, PVD, ALD, and/orother suitable techniques. In an embodiment, the dielectric cappinglayer 610 is formed by ALD process to achieve a conformal sidewallcoverage along sidewalls of the via trench 510. The dielectric cappinglayer 610 is also deposited over portions of the first and secondpatterned HMs, 410 and 420, which will be removed during subsequent etchprocesses.

In the present embodiment, with the dielectric capping layer 610disposed along sidewalls, the width of the via trench 510 is reducedfrom the first width w₁ to a third width w₃. Thus, instead of using alithography process and etching process, a dimension of the via trench510 may be further reduced by forming the dielectric capping layer 610along sidewalls of the via trench 510. As discussed below, dielectriccapping layer 610 allows the remaining portion of via trench 510 tomaintain width w₃ during subsequent etchings.

Referring to FIGS. 1 and 5A, method 100 proceeds to step 110 by etchingthe first patterned HM 410 and the material layer 310 through the secondopening 425 to form a trench 710. The upper portion of the via trench510 is etched away while a lower portion of the via trench 510′ (orremaining via trench 510′) remains covered by dielectric capping layer610. In some embodiments, etch depth is controlled such that the trench710 is formed in an upper portion of the material layer 310 and alignsand connects with the remaining via trench 510′. The trench etch processmay include a wet etch, a dry etch, and/or a combination thereof. Forexample, a dry etching process may use chlorine-containing gases,fluorine-containing gases, other etching gases, or a combinationthereof. The wet etching solutions may include NH₄OH, HF (hydrofluoricacid) or diluted HF, deionized water, TMAH (tetramethylammoniumhydroxide), other suitable wet etching solutions, or combinationsthereof. The trench etch process may be tuned with various etchingparameters, such as etchant used, etching temperature, etching solutionconcentration, etching pressure, etchant flow rate, and/or othersuitable parameters. In some embodiment, the trench etch process mayinclude a selective anisotropic dry etch that etches the exposed firstHM 410 and the material layer 310 through the second opening 425,without substantially etching the dielectric capping layer 610 alongsidewalls of the remaining via trench 510′. In an embodiment, the dryetch process uses a fluorine-based chemistry, such as CF₄, SF₆, CH₂F₂,CHF₃, and/or C₂F₆.

As has been mentioned above, dielectric capping layer 610protects/maintains the profile of remaining via trench 510′ (e.g. widthw₃) during the etching process occurring at step 110. In that regard,the dielectric capping layer 610 protects the material layer 310forming/defining remaining via trench 510′ from exposure to the etchingsolution/gases. This in turn, avoids/prevents the material layer 310forming/defining remaining via trench 510′ from reacting with etchingsolutions/gases that otherwise would form a polymer buildup on thematerial 310 and thereby degrade/change the profile of the remaining viatrench 510′. That is, with its low polymer formation tendency (e.g.non-carbon-containing material) the dielectric capping layer 610 reducesor prevents polymer buildup along sidewalls of the remaining via trench510′. As a result, sidewall profile and width of the remaining viatrench 510′ is preserved, namely width w₃ is preserved. In a particularembodiment, the silicon nitride capping layer 610 preserves sidewallprofile and width w₃ of the remaining via trench 510′ formed in theextra low-k dielectric layer 310 and prevents polymer buildup alongsidewalls of the remaining via trench 510′ during a dry etch processusing a fluorine-based chemistry, such as CF₄, SF₆, CH₂F₂, CHF₃, and/orC₂F₆.

In an alternative embodiment, referring to FIG. 5B, sometimes, corners720 (where the trench 710 connects with the remaining via trench 510′)experiences a higher etch rate (e.g. due to a larger surface for ionicbombardment) and results in rounding corners and/or an un-even loss ofthe dielectric capping layer 610 near the corners 720. As a result, anupper portion 510U of the remaining via trench 510′ has a tapper profilewhile a lower portion 510L of the remaining via trench 510′ has avertical profile. A thickness of the dielectric capping layer 610becomes thinner and thinner along the sidewalls of the upper portion510U towards up to the trench 710. In an embodiment, the dielectriccapping layer 610 does not fully cover the sidewalls of the upperportion 510U and the material layer 310 is exposed in the corners 720.

Referring to FIGS. 1 and 6, method 100 proceeds to step 112 by etchingthe ESL 305 to extend the remaining via trench 510′ through the ESL 305and expose the substrate 210 within the remaining via trench 510′. TheESL 305 may be etched by a wet etch, a dry etch, and/or a combinationthereof. In the present embodiment, similarly, sidewalls of theremaining via trench 510′ are covered by the dielectric capping layer610 during etching the ESL 305 to again prevent polymer buildup alongsidewalls of the remaining via trench 510′ and thereby preserve the viatrench's profile and via trench width, namely the third width w₃. Insome embodiments, the ESL 305 is etched by a selective etch which etchesthe ESL 305 without substantially etch the material layer 310 and thedielectric capping layer 610.

Referring to FIGS. 1 and 7A, method 100 proceeds to step 114 by fillingin the trench 710 and the remaining via trench 510′ with a conductivematerial 810. The conductive material 810 may include seed layers, linerlayers, and/or other multi-layer structures. In some embodiments, priorto forming the conductive material 810, a barrier layer (not shown) isformed first. The barrier layer may include a metal and is electricallyconductive but does not permit inter-diffusion and reactions between thematerial layer 310 (including the dielectric capping layer 610) andconductive material 810 to be filled in the remaining via trench 510′and the trench 710. The barrier layer may include refractory metals andtheir nitrides. In various examples, the first barrier layer includesTiN, TaN, Co, WN, TiSiN, TaSiN, or combinations thereof. The firstbarrier layer may include multiple films.

The conductive material 810 then fills in the remaining via trench 510′and the trench 710, over the barrier layer. The conductive material 810may include metallic nitrides, elemental metals, and/or combinationsthereof. Example compositions include copper (Cu), tungsten (W),titanium (Ti), aluminum (Al), hafnium (Hf), molybdenum (Mo), scandium(Sc), yttium (Y), nickel (Ni), platinum (Pt), and/or other suitablemetals. Example metal nitride compositions include titanium nitride(TiN), tantalum nitride (TaN), tungsten nitride (WN), and/or othersuitable metal nitrides. The barrier layer and the conductive material810 may be formed using one or more deposition steps, such as, ALD, PVD,CVD, plating (ECP), and/or other suitable processes. In an embodiment,the remaining via trench 510′ and the trench 710 are filledcontemporaneously with the same conductive material 810.

In some embodiments, after the deposition of the conductive material810, a planarization process, such as performed by a chemical mechanicalpolishing (CMP) process to be performed to planarize the top surface ofthe conductive material 810. In some embodiments, the CMP process usedto planarize the top surface of the conductive material 810 may alsoserve to remove the first and second HMs, 410 and 420. The conductivematerial 810 remains within the remaining via trench 510′ and the trench710 forms a via feature 820 and a conductive line 830, respectively, asshown in FIG. 7B.

Referring to FIG. 7B, the via feature 820 carries vertical profile ofthe remaining via trench 510′ and has the dielectric capping layer 610along its sidewalls. In another word, the via feature 820 is separatedfrom the material layer 310 by the dielectric capping layer 610. Aportion of the bottom of the conductive line 830 physically contacts tothe via feature 820, including the dielectric capping layer 610 alongsidewalls of the via feature 820. The conductive line 830 has the secondwidth w₂. The via feature 820 may be referred to as Vx, while theconductive line 830 may be referred to as Mx+1, where x is the layer ofthe back-end metallization process.

As shown in FIG. 7C, for circumstances where the dielectric cappinglayer 610 has a tapper profile along sidewalls of the upper portion 510U(as shown in FIG. 5B), the via feature 820 formed by the conductivematerial 810 within the remaining via trench 510′ and the conductiveline 830 formed by the conductive material 810 within the trench 710. Alower portion 820L of the via feature 820 separates from the materiallayer 310 by the dielectric capping layer 610 and has the third widthw₃. An upper portion 820U of the via feature 820 physically contacts tothe material layer 310. A portion of the bottom of the conductive line830 physically contacts to the via feature 820. The conductive line 830has the second width w₂.

Additional process steps may be implemented before, during, and aftermethod 100, and some process steps described above may be replaced oreliminated in accordance with various embodiments of method 100.

Based on the above, it can be seen that the present disclosure providesmethods of forming a second trench over an existing first trench. Themethod employs forming a capping layer along sidewalls of the existingfirst trench to protect it during forming the second trench. With quitesimple and feasible process integration, the method preserves sidewallprofile and width of the existing first trench.

The present disclosure provides many different embodiments of a methodfor forming a semiconductor device. The method includes forming amaterial layer over a substrate and forming a first trench in thematerial layer. The first trench has a first width. The method alsoincludes forming a conformal capping layer along sidewalls of the firsttrench. The capping layer has a different etch rate than the materiallayer. The method also includes forming a second trench in the materiallayer while the capping layer is disposed along sidewalls of the firsttrench. The second trench has a second width which is greater than thefirst width. The second trench is in communication with the firsttrench. The method also includes forming a conductive feature within thefirst trench and the second trench.

In another embodiment, a method includes forming a dielectric layer overa substrate, forming a first patterned hard mask over the dielectriclayer and the first patterned hard mask has a first opening having afirst width. The method also includes forming a second patterned haredmask over the first patterned hard mask and the second patterned hardmask has a second opening having a second width which is greater thanthe first width. The second opening aligns to the first opening. Themethod also includes etching the dielectric layer through the firstopening to form a forming a via trench in the dielectric layer andforming a conformal dielectric capping layer along sidewalls of the viatrench. The dielectric capping layer has a different etch rate than thedielectric layer. The method also includes etching the dielectric layerthrough the second opening to form a trench while the dielectric cappinglayer disposed along sidewalls of the via trench and forming aconductive feature within the via trench and the trench.

In yet another embodiment, a device includes a dielectric layer over asubstrate, a conductive feature disposed in the dielectric layer andphysically contacting the substrate. The conductive feature includes afirst portion having a first width and a second portion having a secondwidth, which is greater than the first width. The device also includes adielectric capping layer disposed along a lower portion of sidewalls ofthe first portion of the conductive feature. The lower portion of thefirst portion of the conductive feature is separated from the dielectriclayer by the dielectric capping layer. An upper portion of the firstportion of the conductive feature physically contacts the dielectriclayer. The dielectric capping layer has a different material than thedielectric layer.

The foregoing outlines features of several embodiments so that thoseskilled in the art may better understand the aspects of the presentdisclosure. Those skilled in the art should appreciate that they mayreadily use the present disclosure as a basis for designing or modifyingother processes and structures for carrying out the same purposes and/orachieving the same advantages of the embodiments introduced herein.Those skilled in the art should also realize that such equivalentconstructions do not depart from the spirit and scope of the presentdisclosure, and that they may make various changes, substitutions, andalterations herein without departing from the spirit and scope of thepresent disclosure.

What is claimed is:
 1. A method comprising: forming an extra-low kdielectric layer over a substrate; forming a first trench in theextra-low k dielectric layer, the extra-low k dielectric defining asidewall of the first trench; forming a non-carbon-containing layerdirectly on the sidewall of the first trench; forming a second trench inthe extra-low k dielectric layer while the non-carbon-containing layeris disposed on the sidewall of the first trench; and after the formingof the second trench, extending the first trench to expose a portion ofthe substrate within the first trench.
 2. The method of claim 1, whereinthe non-carbon-containing layer includes a nitride material.
 3. Themethod of claim 1, wherein the forming of the second trench in theextra-low k dielectric layer while the non-carbon-containing layer isdisposed on the sidewall of the first trench includes removing a portionof the non-carbon-containing layer.
 4. The method of claim 1, furthercomprising forming a conductive feature in the second trench.
 5. Themethod of claim 4, wherein the forming of the conductive feature in thesecond trench include forming the conductive feature in the first trenchsuch that the non-carbon-containing layer disposed on the sidewall ofthe first trench is covered by the conductive feature.
 6. The method ofclaim 1, wherein the extra-low k dielectric layer includes a firsttapered top surface and the non-carbon-containing layer includes asecond tapered top surface that interfaces with the first tapered topsurface after the forming of the second trench in the extra-low kdielectric layer.
 7. The method of claim 1, wherein the substrateincludes a semiconductor material.
 8. A method comprising: forming adielectric layer over a substrate; forming a first patterned materiallayer over the dielectric layer, the first patterned material layerhaving a first opening; forming a second patterned material layer overthe first patterned material layer, the second patterned material layerhaving a second opening that is disposed over the first opening;removing a first portion of the dielectric layer through the firstopening and the second opening to form a first trench within thedielectric layer and through the first hard mask layer; forming asilicon-containing material layer directly on the first patternedmaterial layer, the second patterned material layer and within the firsttrench along sidewalls of the dielectric layer; removing a secondportion of the dielectric layer to form a second trench within thedielectric layer, wherein a portion of the silicon-containing materiallayer is disposed within the first trench after the removing of thesecond portion of the dielectric layer; and after the removing of thesecond portion of the dielectric layer to form the second trench,extending the first trench to expose a portion of the substrate withinthe first trench.
 9. The method of claim 8, wherein the forming of thefirst patterned material layer over the dielectric layer includesforming the first patterned material layer directly on the dielectriclayer such that the portion of the dielectric layer is exposed withinthe first opening.
 10. The method of claim 9, wherein the forming of thesecond patterned material layer over the first patterned material layerincludes forming the second patterned material layer directly on thefirst patterned material layer such that the second opening exposes aportion of the first patterned material layer.
 11. The method of claim10, wherein the removing of the second portion of the dielectric layerto form the second trench within the dielectric layer includes removingthe portion of the first patterned material layer through the secondopening.
 12. The method of claim 8, wherein the removing of the secondportion of the dielectric layer to form the second trench within thedielectric layer includes removing the silicon-containing material layerthat was formed on the first patterned material layer and the secondpatterned material layer.
 13. The method of claim 8, further comprisingremoving at least a portion of the first patterned material layer and atleast a portion of the second patterned material layer to expose a topsurface of the dielectric layer.
 14. The method of claim 13, wherein theremoving of at least the portion of the first patterned material layerand at least the portion of the second patterned material layer toexpose the top surface of the dielectric layer occurs after theextending of the first trench to expose the portion of the substratewithin the first trench.
 15. The method of claim 8, wherein thedielectric layer includes an extra-low k dielectric material, whereinthe first patterned material layer includes silicon nitride, and whereinthe second patterned material layer includes titanium nitride.
 16. Amethod comprising: forming a first material layer over a substrate;forming a second material layer over the first material layer; removinga first portion of the second material layer to form a first trench inthe second material layer, the first trench having a first width andexposing a portion of the first material layer; forming a capping layeron a sidewall of the first material layer within the first trench and onthe portion of the first material layer; removing a second portion ofthe second material layer to form a second trench in the second materiallayer, the second trench having a second width that is different thanthe first width and the second trench in communication with the firsttrench, wherein the capping layer remains disposed on the sidewall ofthe second material layer after the removing of the second portion ofthe second material layer to form the second trench, wherein theremoving of the second portion of the second material layer to form thesecond trench includes removing a portion of the capping layer to exposethe portion of the first material layer; and forming a conductivefeature within the first and second trenches such that the conductivefeature covers the capping layer disposed on the sidewall of the secondmaterial layer.
 17. The method of claim 16, wherein the forming of thecapping layer on the portion of the first material layer includesforming the capping layer directly on the portion of the first materiallayer such that the capping layer physically contacts the portion of thefirst material layer.
 18. The method of claim 16, wherein the secondwidth is wider than the first width.
 19. The method of claim 16, whereinthe second trench is defined by another sidewall of the second materiallayer, wherein the another sidewall is free of the capping layer. 20.The method of claim 19, wherein the forming of the conductive featurewithin the first and second trenches includes forming the conductivedirectly on the another sidewall of the second material layer.